Application Layer represents the built-in FW processing components, loadable FW components and example templates with application libraries required for components integration. Application layer content is assumed to be open source and only proprietary 3rd party components should remain private.
Components in Application Layer¶
The built-in components are built together with base firmware and they have direct access to all firmware drivers and service APIs. When built-in module is enabled in configuration, it is guaranteed to exist in firmware binary.
The loadable components are built separately from base firmware and they are loaded dynamically as a separate binary, depending on the host audio configuration.
All the application layer components access base firmware services via System Services ABI.
NOTE: The built-in components are utility components provided by base firmware/kernel.
Examples of built-in components:
Audio built-in components: Copiers, Mixers, Volume, SRC, etc.
The probe module is special module in FW infrastructure that allows to inject or extract data from a specified probe point. The traditional client platforms use HDA DMAs to transfer data in and out of such module.